FILMBYNA® Non-Silicone
Product Overview
Product Features
Feature 1
Vast lineup
u003culu003ern tu003cliu003eBase film Thickness：19~125μmu003c/liu003ern tu003cliu003eProduct width ：Max 1,580mmu003c/liu003ern tu003cliu003eSurface treatment：single-sided, double-sided with same or differing peeling forceu003c/liu003ern tu003cliu003eType of peeling agent：15 typesu003c/liu003ern tu003cliu003ePeeling force：100 ~ 1,180 gf/25mm※u003c/liu003ernu003c/ulu003ern※ Measurement method: Nitto Denko 31B tape, 70°C x 20h aging under 2000Pa load, 300mm/min (180°) peel measurement
Feature 2
Non-silicone
As there is no silicone used in the processing, it is suitable for particularly sensitive electronic components.
Feature 3
Excellent wettability
Non-silicone type is used as a base/carrier sheet, when casting other resins as films upon it. By doing so, resins casted, cooled, and separated will be given an embossed finish.
Feature 4
Functional assignment
u003culu003ern tu003cliu003eAntistatic：106MΩ or lessu003c/liu003ern tu003cliu003eOligomer Preventionu003c/liu003ern tu003cliu003eCoating matte treatmentu003c/liu003ernu003c/ulu003e