Product Overview

ZAC-LDC is a material for PCBs that connect servers that require high-speed transmission.
It consists of a non-profile copper foil coated with a low transmission loss thermosetting adhesive.

Product Features

Provide adhesion to non-profile copper foil.

The resin is designed to maintain adhesion even to smooth copper foil.

No significant effect on transmission rate.

It maintains the performance of low-dielectric prepregs.

Available for adhesive film itself.

The adhesive film alone can be used for applications that suit the customer’s process.

Available for customization

Not only customization of copper foil thickness and resin thickness, but also resin selection according to the insulation material of the adherend is possible.


For inquiries, please contact us below