Low dielectric bonding film: ZAC-LDC
Product Overview
This is a resin-coated copper foil coated with a primer that improves adhesion to substrate materials with low adhesion, such as the un-roughened copper foil required for high-speed transmission.
Product Features
Feature 1
Provide adhesion to non-profile copper foil.
The resin is designed to maintain adhesion even to smooth copper foil.
Feature 2
No significant effect on transmission rate.
It maintains the performance of low-dielectric prepregs.
Feature 3
Available for customization
The adhesive film alone can be used for applications that suit the customer’s process.
