ZAC-LDC
Product Overview
ZAC-LDC is a material for PCBs that connect servers that require high-speed transmission.
It consists of a non-profile copper foil coated with a low transmission loss thermosetting adhesive.
Product Features
Feature 1
Provide adhesion to non-profile copper foil.
The resin is designed to maintain adhesion even to smooth copper foil.
Feature 2
No significant effect on transmission rate.
It maintains the performance of low-dielectric prepregs.
Feature 3
Available for adhesive film itself.
The adhesive film alone can be used for applications that suit the customer’s process.
Feature 4
Available for customization
Not only customization of copper foil thickness and resin thickness, but also resin selection according to the insulation material of the adherend is possible.
