Low dielectric bonding film: ZAC-LDC
Product Overview
ZAC-LDC enhances adhesion to substrate materials that are typically difficult to bond, such as non-profile copper foil, making it ideal for high-speed transmission applications.
Product Features
Feature 1
Provide adhesion to non-profile copper foil.
The resin is designed to maintain adhesion even to smooth copper foil.
Feature 2
No significant effect on transmission rate.
It maintains the performance of low-dielectric prepregs.
Feature 3
Available for customization
The adhesive film alone can be used for applications that suit the customer’s process.
