ZAC-LDC

Product Overview

ZAC-LDC enhances adhesion to substrate materials that are typically difficult to bond, such as non-profile copper foil, making it ideal for high-speed transmission applications.

Product Features

Provide adhesion to non-profile copper foil.

The resin is designed to maintain adhesion even to smooth copper foil.

No significant effect on transmission rate.

It maintains the performance of low-dielectric prepregs.

Available for adhesive film itself.

The adhesive film alone can be used for applications that suit the customer’s process.

Available for customization

Not only customization of copper foil thickness and resin thickness, but also resin selection according to the insulation material of the adherend is possible.

Contact

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